1141_Packaging Technology_352569
Registration：Now ~ Any Time
Course Period：Now ~ Any Time
LINE sharing feature only supports mobile devices
Course Intro
Course Resources
-
[錄] 09151307
-
[錄] 10131308
-
[錄] 10131427
-
[錄] 10131508
-
[錄] 10201257
-
[錄] 10201308
-
[錄] 10271305
-
5th_FCT-metallurgical reactions Bulk UBM 2025
-
[錄] 11101312
-
[錄] 11101409
-
7th Solders 2025-new
-
11th FCT_EM I Al, Cu and solder lines 2025
-
[錄] 11241422
-
[錄] 11241535
-
12th FCT_EM II solder joints 2025
-
8th_FCT-metallurgical reactions III Six cases 1-4 2025 with Critique [Autosaved]
-
9th_FCT metallurgical reaction IV-cross interactions & massive spalling 2025
-
10th Effect of Solder volume on metalurgical reactions 2025
-
[錄] 12081534
-
[錄] 12151410
-
[錄] 12221442
-
[錄] 12221512
-
13th FCT_EM III void formation & current and temp redistribution & microstructure on EM & Sn Whisker 2025
-
17th 3D IC and Cu-Cu bonding 2025
-
[錄] 12291312
-
[錄] 12291527
Teacher /
Related Courses
|
|
||||||
|
|
|
||||||
|
|
|
||||||
|
|
|
||||||
|