1141_封裝技術_352569
報名期間：從 即日起 到 無限期
上課期間：從 即日起 到 無限期
LINE分享功能只支援行動裝置
課程介紹
課程資源
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[錄] 09151307
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[錄] 10131308
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[錄] 10131427
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[錄] 10131508
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[錄] 10201257
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[錄] 10201308
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[錄] 10271305
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5th_FCT-metallurgical reactions Bulk UBM 2025
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[錄] 11101312
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[錄] 11101409
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7th Solders 2025-new
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11th FCT_EM I Al, Cu and solder lines 2025
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[錄] 11241422
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[錄] 11241535
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12th FCT_EM II solder joints 2025
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8th_FCT-metallurgical reactions III Six cases 1-4 2025 with Critique [Autosaved]
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9th_FCT metallurgical reaction IV-cross interactions & massive spalling 2025
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10th Effect of Solder volume on metalurgical reactions 2025
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[錄] 12081534
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[錄] 12151410
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[錄] 12221442
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[錄] 12221512
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13th FCT_EM III void formation & current and temp redistribution & microstructure on EM & Sn Whisker 2025
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17th 3D IC and Cu-Cu bonding 2025
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[錄] 12291312
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[錄] 12291527
教師 /
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